User meeting and seminar on 15-16 June 2017 in Beijing, China

QForm Group and QForm representative in China Beijing Intelligent United Innovation Technology Co. Ltd are pleased to invite you and your colleagues to User meeting and seminar that will take place in Diyang Tower, Beijing, China on 15-16 June 2017.

QForm VX new version, new features and improvements will be presented within the event.

Timeline:

15 June: Bulk forging, open die forging and ring rolling simulation. New features will be shown:

  • QForm Heat Treatment simulation module
  • electrical upsetting simulation
  • special module for rolling processes simulation
  • automated generation of technical reports
  • new model for die fatigue life analysis
  • Gartfield unique method for surface flow defects prediction

16 June: Profile extrusion simulation. QForm Extrusion new version will be shown:
  • simulation with symmetry planes for even the most complicated symmetrical profiles and multi-profile dies that allows significant reduction of simulation time
  • improved coupled simulation algorithms
  • improved import of IGES bearings
  • new velocity deviation field.

Contact us at market@qform3d.com or qform@iuitgroup.com to get detailed information and register in the event.

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