From 27 to 29 April 2026 the 29th annual ESAFORM conference (European Scientific Association for Material Forming) took place in the historic and vibrant city of Thessaloniki, Greece. Micas Simulations Ltd participated as a Gold Sponsor and joined researchers and industry experts from across Europe.
Nikolay Biba and Polina Shtolina‑Biba represented Micas Simulations at scientific talks and networking meetings
Nikolay Biba delivered two presentations:
An AI-based approach to developing a microstructural model for multi-stage hot deformation processes;
Charge weld evolution in profile extrusion: variability across billets and multi-profile designs.
We thank the ESAFORM organisers and all colleagues who engaged with us during the event. If you attended ESAFORM and would like to continue the conversation, please get in touch at [email protected]

